Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps
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چکیده
In this test setup, embedded die surface temperature sensors are used to assess device electromigration performance using a high precision, high density, resistance measurement system. Solder bump failures are found to result from voiding at the UBM/solder interface where CuSn intermetallic formation and vacancy pileup are observed. The driving mechanisms for electromigration induced voiding are determined experimentally through activation energies measurements in eutectic SnPb and SnAgCu solders.
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تاریخ انتشار 2005